Cold plate device for a two-phase cooling system

ABSTRACT

Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel length and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. The second channel comprise a second channel length that is different than the first channel length.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

This invention was made with Government support under Contract No.:FA8650-14-C-7466 awarded by Defense Advanced Research Projects Agency(DARPA). The Government has certain rights to this invention.

BACKGROUND

The subject disclosure relates to liquid cooling systems, and morespecifically, to two-phase cooling systems for electronics.

SUMMARY

The following presents a summary to provide a basic understanding of oneor more embodiments of the invention. This summary is not intended toidentify key or critical elements, or delineate any scope of theparticular embodiments or any scope of the claims. Its sole purpose isto present concepts in a simplified form as a prelude to the moredetailed description that is presented later. In one or more embodimentsdescribed herein, systems, methods, apparatuses and/or devices thatfacilitate two-phase cooling of an electronic device are described.

According to an embodiment, an apparatus can comprise a first stackablelayer and a second stackable layer. The first stackable layer cancomprise a first channel formed within the first stackable layer. Thefirst channel can comprise a first channel length. Furthermore, thefirst channel can receive a coolant fluid via an inlet port of theapparatus. The second stackable layer can comprise a second channel thatprovides a path for the coolant fluid to flow between the first channeland an outlet port of the apparatus. The second channel can comprise asecond channel length that is different than the first channel length.

According to another embodiment, a method is provided. The method cancomprise receiving coolant fluid via an inlet port of a cold platedevice coupled to an electronic device. The method can also comprisefacilitating flow of the coolant fluid through the cold plate devicebased on a set of expanding channels in the cold plate device. A heightof the set of expanding channels can increase along a flow direction ofthe coolant fluid through the cold plate device. Additionally, themethod can comprise providing an exit for the coolant fluid via anoutlet port of the cold plate device. The outlet port can receive thecoolant fluid from the set of expanding channels.

According to yet another embodiment, a cold plate device can comprise afirst stackable layer and a second stackable layer. The first stackablelayer can comprise a first channel formed within the first stackablelayer. The first channel can receive a coolant fluid via an inlet portof the cold plate device. The second stackable layer can comprise asecond channel formed within the second stackable layer. The firstchannel and the second channel can form a set of expanding channels.Furthermore, a height of the set of expanding channels can increasealong a path for the coolant fluid to flow between the inlet port and anoutlet port of the cold plate device.

DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a block diagram of an example, non-limiting systemassociated with a cold plate device and an electronic device inaccordance with one or more embodiments described herein.

FIG. 2 illustrates an example, non-limiting stackable layer inaccordance with one or more embodiments described herein.

FIG. 3 illustrates another example, non-limiting stackable layer inaccordance with one or more embodiments described herein.

FIG. 4 illustrates a block diagram of another example, non-limitingsystem associated with a cold plate device and an electronic device inaccordance with one or more embodiments described herein.

FIG. 5 illustrates an exploded view of an example, non-limiting coldplate device in accordance with one or more embodiments describedherein.

FIG. 6 illustrates a block diagram of yet another example, non-limitingsystem associated with a cold plate device and an electronic device inaccordance with one or more embodiments described herein.

FIG. 7 illustrates yet another example, non-limiting stackable layer inaccordance with one or more embodiments described herein.

FIG. 8 illustrates an exploded view of another example, non-limitingcold plate device in accordance with one or more embodiments describedherein.

FIG. 9 illustrates a perspective view of an example, non-limiting coldplate device in accordance with one or more embodiments describedherein.

FIG. 10 illustrates a block diagram of an example, non-limiting systemthat facilitates two-phase cooling of an electronic device in accordancewith one or more embodiments described herein.

FIG. 11 illustrates a flow diagram of an example, non-limiting methodthat facilitates two-phase cooling of an electronic device in accordancewith one or more embodiments described herein.

FIG. 12 illustrates a flow diagram of an example, non-limiting methodthat facilitates fabrication of a cold plate device with a set ofexpanding channels in accordance with one or more embodiments describedherein.

FIG. 13 illustrates a flow diagram of an example, non-limiting methodthat facilitates directed two-phase cooling of an electronic device inaccordance with one or more embodiments described herein.

DETAILED DESCRIPTION

The following detailed description is merely illustrative and is notintended to limit embodiments and/or application or uses of embodiments.Furthermore, there is no intention to be bound by any expressed orimplied information presented in the preceding Background or Summarysections, or in the Detailed Description section.

One or more embodiments are now described with reference to thedrawings, wherein like referenced numerals are used to refer to likeelements throughout. In the following description, for purposes ofexplanation, numerous specific details are set forth in order to providea more thorough understanding of the one or more embodiments. It isevident, however, in various cases, that the one or more embodiments canbe practiced without these specific details.

A liquid cooling system can be employed to maintain a temperature of anelectronic device within a certain temperature range and/or to reduce atemperature of the electronic device. For example, a liquid coolant(e.g., coolant fluid) can be passed through a cold plate that is coupledto an electronic device. One type of liquid cooling system is two-phaseliquid cooling. Two-phase liquid cooling can include a pumped two-phasecooling loop in which liquid coolant (e.g., coolant fluid) can enter thecold plate as single phase liquid. The liquid coolant can undergoboiling as the liquid coolant flows through the cold plate. For example,the liquid coolant can boil and evaporate inside the cold plate. Heatgenerated from the electronic device can therefore be converted into thelatent heat and carried away by vapor flow. The liquid coolant can exitthe cold plate as a liquid-vapor mixture (e.g., a two-phase mixture).The liquid-vapor mixture (e.g., two-phase flow of gas and liquid) can bestored in a reservoir and/or can be further employed by the pumpedtwo-phase cooling loop to cool the electronic device coupled to the coldplate. However, flow instabilities can occur with respect to a coldplate employed for two-phase liquid cooling. For example, fluctuation ofmass flux associated with the liquid coolant within the cold plate canoccur, a fluctuation of pressure drop associated with the liquid coolantwithin the cold plate can occur, reversal of direction of liquid coolantflow within the cold plate can occur, etc. Furthermore, flowinstabilities can result in a dry-out condition within the cold platewhere an amount of the liquid coolant within the cold plate is below acertain level. As such, performance of the electronic device can bereduced and/or damage to the electronic device (e.g., failure of theelectronic device) can occur. Moreover, two-phase liquid cooling systemsare generally inefficient.

Embodiments described herein include systems, methods, apparatuses anddevices that facilitate two-phase liquid cooling of an electronicdevice. For example, a novel cold plate device can be coupleable to anelectronic device to facilitate thermal management of the electronicdevice. The cold plate device can include a set of expanding channelsthat facilitate flow of coolant fluid through the cold plate device. Aheight of the set of expanding channels can increase along a flowdirection of the coolant fluid through the cold plate device. Therefore,the set of expanding channels can be implemented as a channel structurewith an inlet orifice that is smaller than an outlet orifice of thechannel structure. The set of expanding channels can also be associatedwith two or more stackable layers of the cold plate device. Forinstance, a first expanding channel from the set of expanding channelscan be formed within a first stackable layer of the cold plate device, asecond expanding channel from the set of expanding channels can beformed within a second stackable layer of the cold plate device, etc.Furthermore, the set of expanding channels can be a set of parallelexpanding channels. For example, the first expanding channel can beparallel to the second expanding channel. The coolant fluid can flowbetween at least the first stackable layer and the second stackablelayer via the first expanding channel and the second expanding channel.

In certain embodiments, the cold plate device can include an auxiliarychannel and/or a nozzle region to facilitate jet impingement cooling ofthe electronic device. In one example, a location of the nozzle regioncan correspond to a particular region of the electronic device thatsatisfies a defined criterion (e.g., a localized region of heatgenerated by the electronic device 104). As such, stable flow of coolantfluid through a cold plate device can be provided. Furthermore, thermalmanagement of an electronic device coupled to a cold plate device can beimproved, performance of an electronic device coupled to a cold platedevice can be improved, and/or damage to an electronic device coupled toa cold plate device can be avoided. For example, a decrease in an amountof pressure drop with respect to a cold plate device can be provided,uniform temperature distribution of a cold plate device can be provided,uniform temperature distribution of an electronic device coupled to acold plate device can be provided, a temperature of an electronic devicecoupled to a cold plate device can be reduced and/or a temperature of anelectronic device coupled to a cold plate device can be efficientlymaintained within a certain range of temperatures. Moreover, efficiencyof a two-phase cooling system (e.g., energy efficiency) of a two-phasecooling system that includes a cold plate device and/or an electronicdevice can be improved.

FIG. 1 illustrates a block diagram of an example, non-limiting system100 that facilitates two-phase liquid cooling in accordance with one ormore embodiments described herein. In various embodiments, the system100 can be a two-phase liquid cooling system. The system 100 can employa novel device (e.g., a novel cold plate device) that is highlytechnical in nature. Further, the system 100 can be employed to solvenew problems that arise through advancements in technology, two-phasecooling systems and/or computer architecture, and the like. One or moreembodiments of the system 100 can provide technical improvements to acold plate device and/or a two-phase cooling system by at leaststabilizing flow of coolant fluid through a cold plate device,decreasing an amount of pressure drop of a cold plate device, improvingthermal management of an electronic device coupled to a cold platedevice, reducing a temperature of an electronic device coupled to a coldplate device, and/or improving energy efficiency of a two-phase coolingsystem.

In the embodiment shown in FIG. 1, the system 100 can include a coldplate device 102 and an electronic device 104. The cold plate device 102can be a two-phase cold plate device. The cold plate device 102 can alsobe an apparatus employed to facilitate cooling of the electronic device104. The cold plate device 102 can include a first stackable layer 106,a second stackable layer 108 and a manifold layer 110. In an alternateembodiment, the second stackable layer 108 and the manifold layer 110can be combined into a single stackable layer. For example, the secondstackable layer 108 can include the manifold layer 110. The firststackable layer 106 can be, for example, base plate layer. The coldplate device 102 shown in FIG. 1 can illustrate a cross-sectional viewof the cold plate device 102. In an embodiment, the cold plate device102 can be formed via a three-dimensional (3D) printing process. Forexample, the first stackable layer 106, the second stackable layer 108and/or the manifold layer 110 can be 3D printed.

The cold plate device 102 can be coupleable and/or coupled to theelectronic device 104. The electronic device 104 can be an electronicdevice package (e.g., an electronic chip package). For example, in someembodiments, the electronic device 104 can be a 3D stacked electronicchip. In another example, the electronic device 104 can be a processorcore (e.g., a complementary metal oxide semiconductor (CMOS) processorcore). The cold plate device 102 can also be employed as a coolingmechanism for the electronic device 104. For instance, the electronicdevice 104 can be a heat source. The electronic device 104 can typicallygenerate heat in response to being operated (e.g., being in a powered onstate) and/or in response to processing data. The heat generated by theelectronic device 104 can be generated as a function of properties forthe device under test such as, for example, power dissipation propertiesfor the electronic device 104, geometric dimensions for the electronicdevice 104, structural properties for the electronic device 104,electrical properties for the electronic device 104 or the like.Therefore, heat generated by the electronic device 104 can be dissipatedvia the cold plate device 102.

In an aspect, coolant fluid (e.g., COOLANT FLUID shown in FIG. 1) can bereceived by the cold plate device 102 to facilitate dissipation of heatgenerated by the electronic device 104. For example, the manifold layer110 can include an inlet port 112 that receives the coolant fluid. Thecold plate device 102 can include a set of channels that are formedwithin the cold plate device 102. The set of channels can receive thecoolant fluid. The set of channels can also allow the coolant fluid toflow through the cold plate device 102. Therefore, the manifold layer110 can be an inlet manifold that receives the coolant fluid andsupplies the coolant fluid to the set of channels that are formed withinthe cold plate device 102. The coolant fluid can be a liquid coolant. Insome embodiments, the coolant fluid can be a liquid dielectric coolant.For example, the coolant fluid can be a liquid dielectric coolant suchas a refrigerant (e.g., R1234ze, R134a, R245fa, etc.) or another type ofliquid dielectric coolant (e.g., ammonia, etc.). In another embodiment,the coolant fluid can be water. In the embodiment shown in FIG. 1, theset of channels can include an inlet channel 114, a first stackablechannel 116, a second stackable channel 118 and/or an outlet channel120. The inlet channel 114 can receive the coolant fluid via the inletport 112. The inlet channel 114 can be formed within the manifold layer110, the second stackable layer 108 and the first stackable layer 106.For example, the inlet channel 114 can be a though-hole region that isformed through the manifold layer 110 and the second stackable layer108. Furthermore, the inlet channel 114 can be formed within a portionof the first stackable layer 106 (e.g., without being a through-holeregion). In an aspect, the first stackable layer 106 can include thefirst stackable channel 116 and the second stackable layer 108 caninclude the second stackable channel 118. A length of the firststackable channel 116 can be different than a length of the secondstackable channel 118. In the embodiment shown in FIG. 1, a length ofthe first stackable channel 116 can be larger than a length of thesecond stackable channel 118. However, in an alternate embodiment, alength of the first stackable channel 116 can be smaller than a lengthof the second stackable channel 118. In an aspect, a solid materialregion of the second stackable layer 108 can be formed between the inletchannel 114 of the second stackable layer 108 and the second stackablechannel 118 of the second stackable layer 108. For example, the solidmaterial region can be a metal region. In another example, the solidmaterial region can be a ceramic region (e.g., an aluminum nitrideregion, etc.). As such, the first stackable channel 116 and the secondstackable channel 118 can form a stepwise channel structure.Furthermore, the first stackable channel 116 and the second stackablechannel 118 can be parallel channels (e.g., parallel stackable channels,parallel microchannels) within the cold plate device 102.

The inlet channel 114, the first stackable channel 116, the secondstackable channel 118 and the outlet channel 120 can provide one or morepaths for the coolant fluid to flow through the cold plate device 102.For instance, the coolant fluid can flow through the inlet channel 114and into the first stackable channel 116. The coolant fluid canadditionally flow through the second stackable channel 118. In anaspect, velocity of the coolant fluid can be reduced when the coolantfluid flows from the first stackable channel 116 into the secondstackable channel 118. The coolant fluid can also flow through theoutlet channel 120 and an outlet port 122 can provide an outlet for thecoolant fluid to exit the cold plate device 102.

In an embodiment, the coolant fluid can be provided to the cold platedevice 102 via a two-phase liquid cooling system. The two-phase liquidcooling system can be, for example, a pumped two-phase cooling loop thatprovides the coolant fluid to the cold plate device 102. The coolantfluid can be employed by the cold plate device 102 to reduce atemperature of the electronic device 104 and/or to offset the heatgenerated by the electronic device 104 in various embodiments. Thecoolant fluid provided to the cold plate device 102 can be transformedinto a liquid-vapor mixture (e.g., a two-phase mixture) as the liquidcoolant flows through the set of channels (e.g., the inlet channel 114,the first stackable channel 116, the second stackable channel 118 andthe outlet channel 120) included in the cold plate device 102. The firststackable channel 116 and the second stackable channel 118 can beimplemented as a set of parallel expanding channels (e.g., a set ofparallel microchannels) to stabilize flow of the coolant fluid throughthe cold plate device 102, to decrease pressure drop of the cold platedevice 102, to reduce a temperature of the electronic device 104, and/orto improve energy efficiency of a two-phase cooling system that includesthe cold plate device 102 and/or the electronic device 104. Along a flowdirection of the coolant fluid, a height of the set of parallelexpanding channels can increase. For example, along a flow direction ofthe coolant fluid, a cross-sectional area of the set of parallelexpanding channels can expand in a vertical direction of the cold platedevice 102. The set of parallel expanding channels can also be a channelstructure where an inlet orifice of the channel structure (e.g., aninlet orifice associated with the inlet channel 114 and the firststackable channel 116) can be smaller than an outlet orifice of thechannel structure (e.g., an outlet orifice associated with the firststackable channel 116, the second stackable channel 118 and the outletchannel 120). As a result, an area of flow for the coolant fluid canincrease within the cold plate device 102.

FIG. 2 illustrates a top view of an example, non-limiting firststackable layer 106 in accordance with one or more embodiments describedherein. Repetitive description of like elements employed in otherembodiments described herein is omitted for sake of brevity.

The first stackable layer 106 can be, for example, a base plate layer ofthe cold plate device 102. In the embodiment shown in FIG. 2, the firststackable layer 106 can include a channel 202 and a set of wallstructures 204 a, 204 b, 204 c, 204 d, 204 e, 204 f, 204 g, 204 h, 204i. The first stackable layer 106 can comprise metal such as copper,aluminum or another type of alloy. Alternatively, the first stackablelayer 106 can comprise a ceramic material (e.g., aluminum nitride,etc.). The first stackable channel 116 can be associated with thechannel 202. For example, at least a portion of the channel 202 cancomprise the first stackable channel 116. The channel 202 can be formedin the first stackable layer 106. In one example, the channel 202 can beformed in the first stackable layer 106 via an etching process (e.g., achemical etching process). In another example, the channel 202 can beformed in the first stackable layer 106 via a machining fabricationprocess. In yet another example, the channel 202 can be formed in thefirst stackable layer 106 via a punching fabrication process (e.g., apunching metal forming process). The set of wall structures 204 a, 204b, 204 c, 204 d, 204 e, 204 f, 204 g, 204 h, 204 i can be raisedstructures associated with the channel 202. For example, a height of awall structure from the set of wall structures 204 a, 204 b, 204 c, 204d, 204 e, 204 f, 204 g, 204 h, 204 i can correspond to a depth of thechannel 202. The set of wall structures 204 a, 204 b, 204 c, 204 d, 204e, 204 f, 204 g, 204 h, 204 i can also be surrounded by the channel 202.For example, the set of wall structures 204 a, 204 b, 204 c, 204 d, 204e, 204 f, 204 g, 204 h, 204 i can be formed within an area thatcorresponds to the channel 202.

FIG. 3 illustrates a top view of an example, non-limiting secondstackable layer 108 in accordance with one or more embodiments describedherein. Repetitive description of like elements employed in otherembodiments described herein is omitted for sake of brevity.

In the embodiment shown in FIG. 3, the second stackable layer 108 caninclude a through-hole region 302 and a patterned through-hole region304. The second stackable layer 108 can comprise metal such as copper,aluminum or another type of alloy. Alternatively, the second stackablelayer 108 can comprise a ceramic material (e.g., aluminum nitride,etc.). The through-hole region 302 can be a hole through the secondstackable layer 108. In one example, the through-hole region 302 can bea rectangular shape or a square shape. However, it is to be appreciatedthat the through-hole region 302 can comprise a different shape such asa circular shape, another type of shape, etc. The patterned through-holeregion 304 can also be a hole through the second stackable layer 108.For instance, the patterned through-hole region 304 can provide a pathfor the coolant fluid to flow between the first stackable channel 116and the second stackable channel 118. A shape of the patternedthrough-hole region 304 can be associated with the channel 202 of thefirst stackable layer 106 and/or the set of wall structures 204 a, 204b, 204 c, 204 d, 204 e, 204 f, 204 g, 204 h, 204 i of the firststackable layer 106.

The through-hole region 302 can provide a path for the coolant fluid toflow between the inlet port 112 and the channel 202 of the firststackable layer 106 (e.g., the first stackable channel 116 of the firststackable layer 106). For example, at least a portion of the inletchannel 114 can comprise the through-hole region 302. The patternedthrough-hole region 304 can provide another path for the coolant fluidto flow between the inlet channel 114 (e.g., a portion of the inletchannel 114 associated with the through-hole region 302) and the outletchannel 120. For example, at least a portion of the patternedthrough-hole region 304 can correspond to the first stackable channel116 and the second stackable channel 118. A size of the patternedthrough-hole region 304 can be determined based at least on a steplength A of the second stackable layer 108. For instance, the steplength A can correspond to a distance between the through-hole region302 and at least a portion of the patterned through-hole region 304. Thestep length A can also be solid material portion (e.g., a metal portionor a ceramic portion) of the second stackable layer 108. For example,the step length A can form a solid material region between thethrough-hole region 302 and the patterned through-hole region 304. Thesize of the through-hole region 302 can additionally be determined basedon a channel length B of the patterned through-hole region 304. Thechannel length B of the patterned through-hole region 304 can correspondto a length of the second stackable channel 118 of the second stackablelayer 108.

FIG. 4 illustrates a block diagram of an example, non-limiting system100′ in accordance with one or more embodiments described herein. Thesystem 100′ can be an alternate embodiment of the system 100. Repetitivedescription of like elements employed in other embodiments describedherein is omitted for sake of brevity.

In the embodiment shown in FIG. 4, the system 100′ can include a coldplate device 102′ and the electronic device 104. The cold plate device102′ can be an alternate embodiment of the cold plate device 102. Thecold plate device 102′ can include the first stackable layer 106, thesecond stackable layer 108, a third stackable layer 402, a fourthstackable layer 404, a fifth stackable layer 406, a sixth stackablelayer 408 and the manifold layer 110. In an alternate embodiment, thesixth stackable layer 408 and the manifold layer 110 can be combinedinto a single stackable layer. For example, the sixth stackable layer408 can include the manifold layer 110. In an embodiment, the cold platedevice 102′ can be formed via a 3D printing process. For example, thefirst stackable layer 106, the second stackable layer 108, the thirdstackable layer 402, the fourth stackable layer 404, the fifth stackablelayer 406, the sixth stackable layer 408 and/or the manifold layer 110can be 3D printed.

In an aspect, the coolant fluid can be received by the cold plate device102′ to facilitate dissipation of heat generated by the electronicdevice 104. The set of channels for the cold plate device 102′ in theembodiment shown in FIG. 4 can include the inlet channel 114, the firststackable channel 116, the second stackable channel 118, a thirdstackable channel 410, a fourth stackable channel 412, a fifth stackablechannel 414, a sixth stackable channel 416 and the outlet channel 120.The inlet channel 114 can receive the coolant fluid via the inlet port112. The inlet channel 114 can be formed within the manifold layer 110,the sixth stackable layer 408, the fifth stackable layer 406, the fourthstackable layer 404, the third stackable layer 402, the second stackablelayer 108 and the first stackable layer 106. For example, the inletchannel 114 can be a though-hole region that is formed through themanifold layer 110, the sixth stackable layer 408, the fifth stackablelayer 406, the fourth stackable layer 404, the third stackable layer 402and the second stackable layer 108. Furthermore, the inlet channel 114can be formed within a portion of the first stackable layer 106 (e.g.,without being a through-hole region). In an aspect, the first stackablelayer 106 can include the first stackable channel 116, the secondstackable layer 108 can include the second stackable channel 118, thethird stackable layer 402 can include the third stackable channel 410,the fourth stackable layer 404 can include the fourth stackable channel412, the fifth stackable layer 406 can include the fifth stackablechannel 414, and the sixth stackable layer 408 can include the sixthstackable channel 416.

The first stackable channel 116, the second stackable channel 118, thethird stackable channel 410, the fourth stackable channel 412, the fifthstackable channel 414, and the sixth stackable channel 416 can comprisedifferent lengths. For example, a length of the first stackable channel116 can be different than a length of the second stackable channel 118,the third stackable channel 410, the fourth stackable channel 412, thefifth stackable channel 414, and the sixth stackable channel 416.Furthermore, a length of the second stackable channel 118 can bedifferent than a length of the first stackable channel 116, the thirdstackable channel 410, the fourth stackable channel 412, the fifthstackable channel 414, and the sixth stackable channel 416. A length ofthe third stackable channel 410 can also be different than a length ofthe first stackable channel 116, the second stackable channel 118, thefourth stackable channel 412, the fifth stackable channel 414, and thesixth stackable channel 416. Moreover, a length of the fourth stackablechannel 412 can be different than a length of the first stackablechannel 116, the second stackable channel 118, the third stackablechannel 410, the fifth stackable channel 414, and the sixth stackablechannel 416. Also, a length of the fifth stackable channel 414 can bedifferent than a length of the first stackable channel 116, the secondstackable channel 118, the third stackable channel 410, the fourthstackable channel 412, and the sixth stackable channel 416. A length ofthe sixth stackable channel 416 can be different than a length of thefirst stackable channel 116, the second stackable channel 118, the thirdstackable channel 410, the fourth stackable channel 412, and the fifthstackable channel 414.

In the embodiment shown in FIG. 4, a length of the first stackablechannel 116 can be larger than a length of the second stackable channel118, the third stackable channel 410, the fourth stackable channel 412,the fifth stackable channel 414, and the sixth stackable channel 416.Furthermore, a length of the second stackable channel 118 can be shorterthat a length of the first stackable channel 116, but longer than alength of the third stackable channel 410, the fourth stackable channel412, the fifth stackable channel 414, and the sixth stackable channel416. A length of the third stackable channel 410 can also be shorterthan a length of the first stackable channel 116 and the secondstackable channel 118, but longer than a length of the fourth stackablechannel 412, the fifth stackable channel 414, and the sixth stackablechannel 416. Moreover, a length of the fourth stackable channel 412 canbe shorter than a length of the first stackable channel 116, the secondstackable channel 118 and the third stackable channel 410, but longerthan a length of the fifth stackable channel 414, and the sixthstackable channel 416. Also, a length of the fifth stackable channel 414can be shorter than a length of the first stackable channel 116, thesecond stackable channel 118, the third stackable channel 410 and thefourth stackable channel 412, but longer than a length of the sixthstackable channel 416. A length of the sixth stackable channel 416 canbe shorter than a length of the first stackable channel 116, the secondstackable channel 118, the third stackable channel 410, the fourthstackable channel 412, and the fifth stackable channel 414.

In an alternate embodiment, a length of the first stackable channel 116can be shorter than a length of the second stackable channel 118, thethird stackable channel 410, the fourth stackable channel 412, the fifthstackable channel 414, and the sixth stackable channel 416. Furthermore,a length of the second stackable channel 118 can be longer that a lengthof the first stackable channel 116, but shorter than a length of thethird stackable channel 410, the fourth stackable channel 412, the fifthstackable channel 414, and the sixth stackable channel 416. A length ofthe third stackable channel 410 can also be longer than a length of thefirst stackable channel 116 and the second stackable channel 118, butshorter than a length of the fourth stackable channel 412, the fifthstackable channel 414, and the sixth stackable channel 416. Moreover, alength of the fourth stackable channel 412 can be longer than a lengthof the first stackable channel 116, the second stackable channel 118 andthe third stackable channel 410, but shorter than a length of the fifthstackable channel 414, and the sixth stackable channel 416. Also, alength of the fifth stackable channel 414 can be longer than a length ofthe first stackable channel 116, the second stackable channel 118, thethird stackable channel 410 and the fourth stackable channel 412, butshorter than a length of the sixth stackable channel 416. A length ofthe sixth stackable channel 416 can be longer than a length of the firststackable channel 116, the second stackable channel 118, the thirdstackable channel 410, the fourth stackable channel 412, and the fifthstackable channel 414.

The inlet channel 114, the first stackable channel 116, the secondstackable channel 118, the third stackable channel 410, the fourthstackable channel 412, the fifth stackable channel 414, the sixthstackable channel 416 and the outlet channel 120 can provide one or morepaths for the coolant fluid to flow through the cold plate device 102′.The coolant fluid can flow through the inlet channel 114 and into thefirst stackable channel 116. The coolant fluid can additionally flowthrough the second stackable channel 118, the third stackable channel410, the fourth stackable channel 412, the fifth stackable channel 414and/or the sixth stackable channel 416. Moreover, the coolant fluid canflow through the outlet channel 120 and an outlet port 122 can providean outlet for the coolant fluid to exit the cold plate device 102′. Thecoolant fluid provided to the cold plate device 102′ can be transformedinto a liquid-vapor mixture (e.g., a two-phase mixture) as the liquidcoolant flows through the set of channels (e.g., the inlet channel 114,the first stackable channel 116, the second stackable channel 118, thethird stackable channel 410, the fourth stackable channel 412, the fifthstackable channel 414, the sixth stackable channel 416, and/or theoutlet channel 120) included in the cold plate device 102′.

The first stackable channel 116, the second stackable channel 118, thethird stackable channel 410, the fourth stackable channel 412, the fifthstackable channel 414 and the sixth stackable channel 416 can beimplemented as a set of parallel expanding channels (e.g., a set ofparallel microchannels) to at least stabilize flow of the coolant fluidthrough the cold plate device 102′, to decrease pressure drop of thecold plate device 102′, to reduce a temperature of the electronic device104, and/or to improve energy efficiency of a two-phase cooling system.Along a flow direction of the coolant fluid, a height of the set ofparallel expanding channels can increase. For example, along a flowdirection of the coolant fluid, a cross-sectional area of the set ofparallel expanding channels can expand in a vertical direction of thecold plate device 102′. The set of parallel expanding channels can alsobe a channel structure where an inlet orifice of the channel structure(e.g., an inlet orifice associated with the inlet channel 114 and thefirst stackable channel 116) can be smaller than an outlet orifice ofthe channel structure (e.g., an outlet orifice associated with the firststackable channel 116, the second stackable channel 118, the thirdstackable channel 410, the fourth stackable channel 412, the fifthstackable channel 414, the sixth stackable channel 416 and the outletchannel 120). As a result, an area of flow for the coolant fluid canincrease within the cold plate device 102′.

FIG. 5 illustrates an exploded view of an example, non-limiting coldplate device 102′ associated with the system 100′ in accordance with oneor more embodiments described herein. Repetitive description of likeelements employed in other embodiments described herein is omitted forsake of brevity.

In the embodiment shown in FIG. 5, the cold plate device 102′ caninclude the first stackable layer 106, the second stackable layer 108,the third stackable layer 402, the fourth stackable layer 404, the fifthstackable layer 406, the sixth stackable layer 408 and the manifoldlayer 110. The manifold layer 110 can include the inlet port 112 and theoutlet port 122. In an aspect, the first stackable layer 106 can includethe channel 202 and the set of wall structures 204 a, 204 b, 204 c, 204d, 204 e, 204 f, 204 g, 204 h, 204 i. Furthermore, the second stackablelayer 108 can include the through-hole region 302 and the patternedthrough-hole region 304. It is to be appreciated that the number ofstackable layers and/or the number of stackable channels can be variedbased on design criteria of a particular implementation. In an aspect,the coolant liquid can enter the cold plate device 102′ (e.g., via theinlet port 112) as a single-phase liquid flow. Furthermore, at least aportion of the coolant liquid can evaporate inside the inlet channel114, the first stackable channel 116, the second stackable channel 118,the third stackable channel 410, the fourth stackable channel 412, thefifth stackable channel 414 and/or the sixth stackable channel 416 andthe outlet channel 120. As such, the coolant liquid can exit the coldplate device (e.g., via the outlet port 122) as a liquid-vapor mixture(e.g., a two-phase mixture).

In another aspect, a step length can be different for the firststackable layer 106, the second stackable layer 108, the third stackablelayer 402, the fourth stackable layer 404, the fifth stackable layer 406and/or the sixth stackable layer 408. For instance, a step length C forthe sixth stackable layer 408 can be larger than the step length A forthe second stackable layer 108 and/or a step length for the thirdstackable layer 402, the fourth stackable layer 404 and/or the fifthstackable layer 406. In one example, size of a through-hole region 502of the sixth stackable layer 408 can be determined based at least on thestep length C of the sixth stackable layer 408. For example, the steplength C can correspond to a distance between the through-hole region502 and a patterned through-hole region 504 of the sixth stackable layer408.

FIG. 6 illustrates a block diagram of an example, non-limiting system100″ in accordance with one or more embodiments described herein. Thesystem 100″ can be an alternate embodiment of the system 100 and/or thesystem 100′. Repetitive description of like elements employed in otherembodiments described herein is omitted for sake of brevity.

In the embodiment shown in FIG. 6, the system 100″ can include a coldplate device 102″ and the electronic device 104. The cold plate device102″ can be an alternate embodiment of the cold plate device 102 and/orthe cold plate device 102′. The cold plate device 102″ can include thefirst stackable layer 106, the second stackable layer 108, the thirdstackable layer 402, the fourth stackable layer 404, a fifth stackablelayer 602, the sixth stackable layer 408 and the manifold layer 110. Inan alternate embodiment, the sixth stackable layer 408 and the manifoldlayer 110 can be combined into a single stackable layer. For example,the sixth stackable layer 408 can include the manifold layer 110. In anembodiment, the cold plate device 102″ can be formed via a 3D printingprocess. For example, the first stackable layer 106, the secondstackable layer 108, the third stackable layer 402, the fourth stackablelayer 404, the fifth stackable layer 602, the sixth stackable layer 408and/or the manifold layer 110 can be 3D printed.

In an aspect, the coolant fluid can be received by the cold plate device102″ to facilitate dissipation of heat generated by the electronicdevice 104. The set of channels for the cold plate device 102″ in theembodiment shown in FIG. 6 can include the inlet channel 114, anauxiliary channel 604, the first stackable channel 116, the secondstackable channel 118, the third stackable channel 410, the fourthstackable channel 412, the fifth stackable channel 414, the sixthstackable channel 416 and/or the outlet channel 120. The inlet channel114 can receive the coolant fluid via the inlet port 112. The inletchannel 114 can be formed within the manifold layer 110, the sixthstackable layer 408, the fifth stackable layer 602, the fourth stackablelayer 404, the third stackable layer 402, the second stackable layer 108and the first stackable layer 106. For example, the inlet channel 114can be a though-hole region that is formed through the manifold layer110, the sixth stackable layer 408, the fifth stackable layer 602, thefourth stackable layer 404, the third stackable layer 402 and the secondstackable layer 108. Furthermore, the inlet channel 114 can be formedwithin a portion of the first stackable layer 106 (e.g., without being athrough-hole region). In another aspect, the first stackable layer 106can include the first stackable channel 116, the second stackable layer108 can include the second stackable channel 118, the third stackablelayer 402 can include the third stackable channel 410, the fourthstackable layer 404 can include the fourth stackable channel 412, thefifth stackable layer 602 can include the auxiliary channel 604 and thefifth stackable channel 414, and the sixth stackable layer 408 caninclude the sixth stackable channel 416. A solid material region (e.g.,a metal region or a ceramic region) of the fifth stackable layer 602 canbe formed between the auxiliary channel 604 of the fifth stackable layer602 and the fifth stackable channel 414 of the fifth stackable layer602.

The inlet channel 114, the auxiliary channel 604, the first stackablechannel 116, the second stackable channel 118, the third stackablechannel 410, the fourth stackable channel 412, the fifth stackablechannel 414, the sixth stackable channel 416 and the outlet channel 120can provide one or more paths for the coolant fluid to flow through thecold plate device 102″. The auxiliary channel 604 can receive thecoolant fluid from the inlet channel 114. The coolant fluid can alsoflow through the auxiliary channel 604. Furthermore, the coolant fluidcan be provided to the first stackable channel 116, the second stackablechannel 118, the third stackable channel 410, the fourth stackablechannel 412, the fifth stackable channel 414, the sixth stackablechannel 416 and/or the outlet channel 120 via the auxiliary channel 604.For example, a nozzle region 606 of the auxiliary channel 604 canprovide an opening between at least the fourth stackable channel 412 andthe auxiliary channel 604. Additionally, the coolant fluid can flowthrough the inlet channel 114 and into the first stackable channel 116.The coolant fluid can also flow through the second stackable channel118, the third stackable channel 410, the fourth stackable channel 412,the fifth stackable channel 414 and/or the sixth stackable channel 416.Moreover, the coolant fluid can flow through the outlet channel 120 andan outlet port 122 can provide an outlet for the coolant fluid to exitthe cold plate device 102″. The coolant fluid provided to the cold platedevice 102″ can be transformed into a liquid-vapor mixture (e.g., atwo-phase mixture) as the liquid coolant flows through the set ofchannels (e.g., the inlet channel 114, the auxiliary channel 604, thefirst stackable channel 116, the second stackable channel 118, the thirdstackable channel 410, the fourth stackable channel 412, the fifthstackable channel 414, the sixth stackable channel 416, and/or theoutlet channel 120) included in the cold plate device 102″.

The cold plate device 102″ shown in FIG. 6 can be a hybrid cold platedevice that provides both stabilized two-phase flow via the set ofexpanding channels and directed cooling with respect to a hot spotregion 608 of the electronic device 104. In an aspect, a location of thenozzle region 606 can correspond to the hot spot region 608 of theelectronic device 104. The nozzle region 606 can facilitate directedheat transfer (e.g., directed cooling) for the hot spot region 608 ofthe electronic device 104. For example, the nozzle region 606 can be anopening that creates jet impingement and/or spray cooling for the hotspot region 608 of the electronic device 104. The hot spot region 608can also be a region of the electronic device 104 that satisfies adefined criterion. For example, the hot spot region 608 can be alocalized region of heat generated by the electronic device 104. Assuch, a location of the nozzle region 606 corresponds to the hot spotregion 608 of the electronic device 104 that satisfies a definedcriterion with respect to an amount of heat generated by the electronicdevice 104. Furthermore, the hot spot region 608 can enhance thermalmanagement with respect to the hot spot region 608 of the electronicdevice 104. Additionally, the auxiliary channel 604, the first stackablechannel 116, the second stackable channel 118, the third stackablechannel 410, the fourth stackable channel 412, the fifth stackablechannel 414 and/or the sixth stackable channel 416 can be implemented asa set of hybrid expanding channels to facilitate stabilized two-phaseflow throughout the cold plate device 102″ and directed cooling withrespect to the hot spot region 608 of the electronic device 104.

FIG. 7 illustrates a top view of an example, non-limiting fifthstackable layer 602 in accordance with one or more embodiments describedherein. Repetitive description of like elements employed in otherembodiments described herein is omitted for sake of brevity.

In the embodiment shown in FIG. 7, the fifth stackable layer 602 caninclude a through-hole region 702 and a patterned through-hole region704. The fifth stackable layer 602 can also include an auxiliary channel604 a and an auxiliary channel 604 b. The auxiliary channel 604 a and/orthe auxiliary channel 604 b can be associated with the auxiliary channel604 shown in FIG. 6. For example, at least a portion of the auxiliarychannel 604 a and/or the auxiliary channel 604 b can correspond to theauxiliary channel 604.

The fifth stackable layer 602 can comprise metal such as copper,aluminum or another type of alloy. Alternatively, the fifth stackablelayer 602 can comprise a ceramic material (e.g., aluminum nitride,etc.). The through-hole region 702 can be a hole through the fifthstackable layer 602. In one example, the through-hole region 702 can bea rectangular shape or a square shape. However, it is to be appreciatedthat the through-hole region 702 can comprise a different shape such asa circular shape, another type of shape, etc. The patterned through-holeregion 704 can also be a hole through the fifth stackable layer 602. Ashape of the patterned through-hole region 704 can be associated withthe channel 202 of the first stackable layer 106 and/or the set of wallstructures 204 a, 204 b, 204 c, 204 d, 204 e, 204 f, 204 g, 204 h, 204 iof the first stackable layer 106. Furthermore, a size of the patternedthrough-hole region 704 can be smaller than a size of other patternedthrough-hole regions associated with other stackable layers (e.g., thepatterned through-hole region 304 of the second stackable layer 108).

The through-hole region 702 can provide a path for the coolant fluid toflow between the inlet port 112 and the set of channels for the coldplate device 102″. For example, at least a portion of the inlet channel114 can comprise the through-hole region 702. The patterned through-holeregion 704 can provide another path for the coolant fluid to flowbetween the inlet channel 114 (e.g., a portion of the inlet channel 114associated with the through-hole region 702) and the outlet channel 120.For instance, at least a portion of the patterned through-hole region704 can correspond to the first stackable channel 116, the secondstackable channel 118, the third stackable channel 410, the fourthstackable channel 412 and/or the sixth stackable channel 416. A size ofthe patterned through-hole region 704 can be determined based at leaston a step length D of the fifth stackable layer 602. For example, thestep length D can correspond to a distance between a portion of thethrough-hole region 702 and the patterned through-hole region 704. Thesize of the through-hole region 702 can additionally be determined basedon a channel length E of the patterned through-hole region 704. Thechannel length E of the patterned through-hole region 704 can correspondto a length of the fifth stackable channel 414 of the fifth stackablelayer 602. Furthermore, a channel length F of the auxiliary channel 604a and/or the auxiliary channel 604 b can correspond to a length of theauxiliary channel 604. It is to be appreciated that a number ofauxiliary channels for a stackable layer can be varied based a number ofhot spot regions and/or a location of hot spot regions of the electronicdevice 104. For example, a stackable layer can include a singleauxiliary channel. In another example, a stackable layer can includemore than two auxiliary channels.

FIG. 8 illustrates an exploded view of an example, non-limiting coldplate device 102″ associated with the system 100″ in accordance with oneor more embodiments described herein. Repetitive description of likeelements employed in other embodiments described herein is omitted forsake of brevity.

In the embodiment shown in FIG. 8, the cold plate device 102″ caninclude the first stackable layer 106, the second stackable layer 108,the third stackable layer 402, the fourth stackable layer 404, the fifthstackable layer 602, the sixth stackable layer 408 and the manifoldlayer 110. The manifold layer 110 can include the inlet port 112 and theoutlet port 122. In an aspect, the first stackable layer 106 can includethe channel 202 and the set of wall structures 204 a, 204 b, 204 c, 204d, 204 e, 204 f, 204 g, 204 h, 204 i. Furthermore, the second stackablelayer 108 can include the through-hole region 302 and the patternedthrough-hole region 304. It is to be appreciated that the number ofstackable layers and/or the number of stackable channels can be variedbased on design criteria of a particular implementation. In an aspect,the coolant liquid can enter the cold plate device 102″ (e.g., via theinlet port 112) as a single-phase liquid flow. Furthermore, at least aportion of the coolant liquid can evaporate inside the inlet channel114, the auxiliary channel 604 (e.g., the auxiliary channel 604 b), thefirst stackable channel 116, the second stackable channel 118, the thirdstackable channel 410, the fourth stackable channel 412, the fifthstackable channel 414 and/or the sixth stackable channel 416 and theoutlet channel 120. As such, the coolant liquid can exit the cold platedevice (e.g., via the outlet port 122) as a liquid-vapor mixture (e.g.,a two-phase mixture).

In another aspect, a step length can be different for the firststackable layer 106, the second stackable layer 108, the third stackablelayer 402, the fourth stackable layer 404, the fifth stackable layer 406and/or the sixth stackable layer 408. For instance, a step length C forthe sixth stackable layer 408 can be larger than the step length D forthe fifth stackable layer 406, the step length A for the secondstackable layer 108, and/or a step length for the third stackable layer402 and/or the fourth stackable layer 404. In one example, size of thethrough-hole region 702 of the fifth stackable layer 602 can bedetermined based at least on the step length D of the fifth stackablelayer 602. For example, the step length D can correspond to a distancebetween the through-hole region 702 and a portion of the patternedthrough-hole region 704.

FIG. 9 illustrates a perspective view of an example, non-limiting coldplate device 900 in accordance with one or more embodiments describedherein. Repetitive description of like elements employed in otherembodiments described herein is omitted for sake of brevity.

The cold plate device 900 can correspond to the cold plate device 102,the cold plate device 102′ and/or the cold plate device 102″. The coldplate device 900 can be stacked with multiple layers. In the embodimentshown in FIG. 9, the cold plate device 900 can include the firststackable layer 106, one or more other stackable layers 902 _(1-N) andthe manifold layer 110. In an embodiment, the cold plate device 900 canbe formed via a 3D printing process. For example, the first stackablelayer 106, the one or more other stackable layers 902 _(1-N) and/or themanifold layer 110 can be 3D printed. The one or more other stackablelayers 902 _(1-N) can include, for example, the first stackable layer106, the second stackable layer 108, the third stackable layer 402, thefourth stackable layer 404, the fifth stackable layer 406, the fifthstackable layer 602 and/or the sixth stackable layer 408. The coolantfluid can enter the cold plate device 900 as liquid coolant via theinlet port 112. Furthermore, the coolant fluid can exit the cold platedevice 900 as a mixture of vapor and liquid via the outlet port 122. Astackable layer from the one or more other stackable layers 902 _(1-N)can be a metal layer (e.g., a metal sheet). Additionally oralternatively, a stackable layer from the one or more stackable layers902 _(1-N) can be a ceramic layer. Furthermore, a stackable layer fromthe one or more other stackable layers 902 _(1-N) can include one ormore through-layer patterns and/or one or more through-holes. Forexample, a stackable layer from the one or more other stackable layers902 _(1-N) can include one or more through-hole regions, one or morepatterned through-hole regions and/or or one or more auxiliary channels.In a non-limiting example, the one or more other stackable layers 902_(1-N) can include the second stackable layer 108, the third stackablelayer 402, the fourth stackable layer 404, the fifth stackable layer406, the fifth stackable layer 602 and/or the sixth stackable layer 408.

The cold plate device 900 can be assembled via one or more fabricationsteps. For example, during a fabrication step, the first stackable layer106, the one or more other stackable layers 902 _(1-N) and/or themanifold layer 110 can be stacked. During another fabrication step, thefirst stackable layer 106, the one or more other stackable layers 902_(1-N) and/or the manifold layer 110 can be aligned. During yet anotherfabrication step, sintering associated with the cold plate device 900can be performed in response to pressure applied to a surface of themanifold layer and a surface of the first stackable layer 106 (e.g., atop surface of the cold plate device 900 and a bottom surface of thecold plate device 900). Additionally or alternatively, during anotherfabrication step, welding associated with the cold plate device 900 canbe performed in response to pressure applied to a surface of themanifold layer and a surface of the first stackable layer 106 (e.g., atop surface of the cold plate device 900 and a bottom surface of thecold plate device 900).

FIG. 10 illustrates an example, non-limiting system 1000 thatfacilitates two-phase liquid cooling of an electronic device inaccordance with one or more embodiments described herein. Repetitivedescription of like elements employed in other embodiments describedherein is omitted for sake of brevity.

In the embodiment shown in FIG. 10, the system 1000 includes a coldplate device 1002, a reservoir 1004, a pump 1006, a pre-heater 1008, anda condenser 1010. The cold plate device 1002 can correspond to a coldplate device shown and/or described with respect to FIGS. 1-9. Forexample, the cold plate device 1002 can correspond to the cold platedevice 102, the cold plate device 102′, the cold plate device 102″and/or the cold plate device 900. In an aspect, the cold plate device1002 can include the first stackable layer 106, the second stackablelayer 108, the third stackable layer 402, the fourth stackable layer404, the fifth stackable layer 406, the fifth stackable layer 602, thesixth stackable layer 408 and/or the manifold layer 110.

The cold plate device 1002 can comprise a set of channels (e.g., a setof expanding channels, a set of parallel expanding channels, etc.), asmore fully disclosed herein. For instance, the cold plate device 1002can include the inlet channel 114, an auxiliary channel 604, the firststackable channel 116, the second stackable channel 118, the thirdstackable channel 410, the fourth stackable channel 412, the fifthstackable channel 414, the sixth stackable channel 416 and/or the outletchannel 120. The set of channels for the cold plate device 1002 can be aset of expanding channels where a height of the set of expandingchannels increases along a flow direction of the coolant fluid.Therefore, a path for coolant fluid can be provided in the cold platedevice 1002 via a novel channel structure. In an aspect, the set ofchannels of the cold plate device 1002 can include one or morethrough-hole portions, one or more patterned through-hole portionsand/or one or more auxiliary channels.

An electronic device (e.g., the electronic device 104) coupled to thecold plate device 1002 can generate heat in response to being operatedand/or processing data. The heat generated by the electronic device(e.g., the electronic device 104) can be generated as a function of theproperties for the electronic device (e.g., the electronic device 104).The reservoir 1004, the pump 1006, the pre-heater 1008, and/or thecondenser 1010 can be implemented as a two-phase cooling system for thecold plate device 1002 and/or the electronic device (e.g., theelectronic device 104). For example, the reservoir 1004, the pump 1006,the pre-heater 1008, and/or the condenser 1010 can be implemented as apumped two-phase cooling loop that provides the coolant fluid to thecold plate device 1002. The reservoir 1004 can store the coolant fluid(e.g., liquid coolant). In one example, the coolant fluid stored by thereservoir 1004 can be water. In another example, the coolant fluidstored by the reservoir 1004 can be a refrigerant. In yet anotherexample, the coolant fluid stored by the reservoir 1004 can be adielectric coolant. The coolant fluid stored by the reservoir 1004 canbe provided to the cold plate device 1002. In an implementation, thecoolant fluid stored by the reservoir 1004 can be provided to the coldplate device 1002 (e.g., directly to the inlet port 112 of the coldplate device 1002) via a pump 1006. For example, the pump 1006 can pumpthe coolant fluid from the reservoir 1004 to the cold plate device 1002.However, in another implementation, the pre-heater 1008 can control atemperature of the coolant fluid that is provided to the cold platedevice 1002. For example, the pump 1006 can pump the coolant fluid fromthe reservoir 1004 to the pre-heater 1008 and the pre-heater 1008 canprovide the coolant fluid to the cold plate device 1002.

The coolant fluid can enter the cold plate device 1002 as single phaseliquid. The coolant fluid provided to the cold plate device 1002 can beemployed by the cold plate device 1002 to reduce a temperature of thecold plate device 1002 and/or to offset the heat generated by the coldplate device 1002. The coolant fluid provided to the cold plate device1002 can be transformed into a liquid-vapor mixture (e.g., a two-phasemixture) as the coolant fluid flows through the cold plate device 1002.For example, the coolant fluid can undergo boiling as the coolant fluidflows through the set of channels within the cold plate device 1002. Thecoolant fluid can exit the cold plate device 1002 as a liquid-vapormixture (e.g., a two-phase mixture). The condenser 1010 can condense thevapor exiting from the cold plate device 1002. In certainimplementations, the condenser 1010 can transfer heat from the coldplate device 1002 to an external cooling loop (not shown). Liquid fromthe condenser 1010 can flow into the reservoir 1004. The liquid (e.g.,the coolant fluid) from the reservoir 1004 can then be pumped back intothe cold plate device 1002 employing the pump 1006. In an alternateembodiment, a filter (not shown) can be implemented between the pump1006 and the cold plate device 1002 to remove debris or residue from thecoolant fluid provided to the cold plate device 1002 and/or to preventthe set of channels of the cold plate device 1002 from clogging.

FIG. 11 illustrates a flow diagram of an example, non-limiting method1100 that facilitates two-phase cooling of an electronic device inaccordance with one or more embodiments described herein. Repetitivedescription of like elements employed in other embodiments describedherein is omitted for sake of brevity.

At 1102, coolant fluid is received via an inlet port of a cold platedevice (e.g., cold plate device 102, cold plate device 102′, cold platedevice 102″, cold plate device 900 or cold plate device 1002) coupled toan electronic device. The coolant fluid can be a liquid coolant. Forexample, the coolant fluid can be a liquid dielectric coolant such as,but not limited to, water, a refrigerant or another type of liquiddielectric coolant. The cold plate device can comprise a set ofstackable layers. A stackable layer from the set of stackable layers canbe a solid material layer (e.g., a metal layer or a ceramic layer) thatincludes one or more through-hole regions, one or more patternedthrough-hole regions and/or one or more auxiliary channels. Furthermore,the cold plate device can facilitate cooling (e.g., two-phase cooling)of the electronic device coupled to the cold plate device. The inletport of the cold plate device can be an opening of the cold plate devicethat receives the coolant fluid. In an aspect, the coolant fluid can beprovided to the cold plate device (e.g., the inlet port of the coldplate device) via a two-phase liquid cooling system. For example, thetwo-phase liquid cooling system can be a pumped two-phase cooling loopthat provides the coolant fluid to the cold plate device (e.g., theinlet port of the cold plate device).

At 1104, flow of the coolant fluid through the cold plate device (e.g.,cold plate device 102, cold plate device 102′, cold plate device 102″,cold plate device 900 or cold plate device 1002) is facilitated based ona set of expanding channels in the cold plate device, where a height ofthe set of expanding channels increases along a flow direction of thecoolant fluid through the cold plate device. The inlet port of the coldplate device can provide the coolant fluid to the set of expandingchannels. Furthermore, through-hole regions, patterned through-holeregions and/or one or more auxiliary channels of the set of stackablelayers can form the set of expanding channels. The set of expandingchannels (e.g., the increase of the height of the set of expandingchannels along the flow direction of the coolant fluid through the coldplate device) can allow two-phase flow of the coolant fluid to expand ina vertical direction with respect to the cold plate device. In anaspect, the coolant fluid (e.g., the liquid coolant) that flows throughthe cold plate device via the set of expanding channels can betransformed into a liquid-vapor mixture (e.g., a two-phase mixture) asthe liquid coolant flows through the set of expanding channels. Inanother aspect, the coolant fluid can be employed by the cold platedevice to reduce a temperature of the electronic device coupled to thecold plate device and/or to offset heat generated by the electronicdevice coupled to the cold plate device.

At 1106, an exit for the coolant fluid is provided via an outlet port ofthe cold plate device (e.g., cold plate device 102, cold plate device102′, cold plate device 102″, cold plate device 900 or cold plate device1002), where the outlet port receives the coolant fluid from the set ofexpanding channels. For example, the outlet port can receive the coolantfluid as liquid coolant (e.g., in a liquid state) from the set ofexpanding channels. In another example, the outlet port can receive thecoolant fluid as a liquid-vapor mixture (e.g., in a liquid-vapor state)from the set of expanding channels. In an aspect, the coolant fluid thatexits the outlet port of the cold plate device can be pumped back intothe cold plate device (e.g., the inlet port of the cold plate device)via the pumped two-phase cooling loop associated with the cold platedevice.

FIG. 12 illustrates a flow diagram of an example, non-limiting method1200 that facilitates fabrication of a cold plate device with a set ofexpanding channels in accordance with one or more embodiments describedherein. At 1202, a channel is formed in a stackable layer (e.g., firststackable layer 106) for a cold plate device that provides thermalmanagement of an electronic device. The stackable layer can comprisemetal such as copper, aluminum or another type of alloy. Alternatively,the stackable layer can comprise a ceramic material (e.g., aluminumnitride, etc.). In one example, the channel can be formed in thestackable layer via an etching process (e.g., a chemical etchingprocess). In another example, the channel can be formed in the stackablelayer via a machining fabrication process. In yet another example, thechannel can be formed in the stackable layer via a punching fabricationprocess (e.g., a punching metal forming process). In an aspect, thechannel can be associated with a set of wall structures). The set ofwall structures can be raised structures that are formed within an areaassociated with the channel. For example, a height of a wall structurefrom the set of wall structures can correspond to a depth of the channelformed in the stackable layer. Furthermore, the set of wall structurescan be surrounded by the channel.

At 1204, one or more other channels are formed in one or more otherstackable layers (e.g., one or more other stackable layers 90 _(21-N))for the cold plate device, the one or more other channels comprising adifferent length than the channel. The one or more other stackablelayers can comprise metal such as copper, aluminum or another type ofalloy. Additionally or alternatively, the one or more other stackablelayers can comprise a ceramic material (e.g., aluminum nitride, etc.).In one example, the one or more other channels can be formed in the oneor more other stackable layers via an etching process (e.g., a chemicaletching process). In another example, the one or more other channels canbe formed in the one or more other stackable layers layer via amachining fabrication process. In yet another example, the one or moreother channels can be formed in the one or more other stackable layersvia a punching fabrication process (e.g., a punching metal formingprocess). In an aspect, the one or more other channels can be one ormore through-hole regions, one or more patterned through-hole regionsand/or one or more auxiliary channels.

At 1206, the stackable layer and the one or more other stackable layersare attached to facilitate flow of liquid coolant through the cold platedevice (e.g., cold plate device 102) via the channel and the one or moreother channels. For example, the stackable layer and the one or moreother stackable layers can be stacked to form the cold plate device. Inan aspect, the stackable layer and the one or more other stackablelayers can be aligned to facilitate alignment of the channel and the oneor more other channels. Additionally, sintering associated with thestackable layer and the one or more other stackable layers can beperformed in response to pressure applied to a set of surfacesassociated with the stackable layer and the one or more other stackablelayers (e.g., a top surface of the cold plate device and a bottomsurface of the cold plate device). Additionally or alternatively,welding associated with the stackable layer and the one or more otherstackable layers can be performed in response to pressure applied to aset of surfaces associated with the stackable layer and the one or moreother stackable layers (e.g., a top surface of the cold plate device anda bottom surface of the cold plate device).

FIG. 13 illustrates a flow diagram of an example, non-limiting method1300 that facilitates directed two-phase cooling of an electronic devicein accordance with one or more embodiments described herein. At 1302, achannel is formed in a stackable layer (e.g., first stackable layer 106)for a cold plate device that provides thermal management of anelectronic device. The stackable layer can comprise metal such ascopper, aluminum or another type of alloy. Alternatively, the stackablelayer can comprise a ceramic material (e.g., aluminum nitride, etc.). Inone example, the channel can be formed in the stackable layer via anetching process (e.g., a chemical etching process). In another example,the channel can be formed in the stackable layer via a machiningfabrication process. In yet another example, the channel can be formedin the stackable layer via a punching fabrication process (e.g., apunching metal forming process). In an aspect, the channel can beassociated with a set of wall structures). The set of wall structurescan be raised structures that are formed within an area associated withthe channel. For example, a height of a wall structure from the set ofwall structures can correspond to a depth of the channel formed in thestackable layer. Furthermore, the set of wall structures can besurrounded by the channel.

At 1304, one or more other channels are formed in one or more otherstackable layers for the cold plate device, the one or more otherchannels (e.g., one or more other stackable layers 90 _(21-N))comprising a different length than the channel. The one or more otherstackable layers can comprise metal such as copper, aluminum or anothertype of alloy. Additionally or alternatively, the one or more otherstackable layers can comprise a ceramic material (e.g., aluminumnitride, etc.). In one example, the one or more other channels can beformed in the one or more other stackable layers via an etching process(e.g., a chemical etching process). In another example, the one or moreother channels can be formed in the one or more other stackable layerslayer via a machining fabrication process. In yet another example, theone or more other channels can be formed in the one or more otherstackable layers via a punching fabrication process (e.g., a punchingmetal forming process). In an aspect, the one or more other channels canbe one or more through-hole regions, one or more patterned through-holeregions and/or one or more auxiliary channels.

At 1306, a nozzle region (e.g., nozzle region 606) is formed in thestackable layer that allows coolant fluid to flow from the channel tothe one or more other channels, where a location of the nozzle regioncorresponds to a hot spot region of the electronic device. For example,the nozzle region can provide an opening between a channel from the oneor more other channels and another channel (e.g., an auxiliary channel)from the one or more other channels. In another example, the nozzleregion can be associated with an auxiliary channel of the stackablelayer. As such, the nozzle region can provide an opening between achannel from the one or more other channels and the auxiliary channel.In an aspect, a location of the nozzle region can correspond to a hotspot region of the electronic device. The nozzle region can facilitatedirected heat transfer (e.g., directed cooling) for the hot spot regionof the electronic device 104. For instance, the nozzle region can be anopening that creates jet impingement and/or spray cooling for the hotspot region of the electronic device.

At 1308, the stackable layer and the one or more other stackable layersare attached to facilitate flow of liquid coolant through the cold platedevice (e.g., cold plate device 102, cold plate device 102′, cold platedevice 102″, cold plate device 900 or cold plate device 1002) via thechannel, the one or more other channels and the nozzle region. Forexample, the stackable layer and the one or more other stackable layerscan be stacked to form the cold plate device. In an aspect, thestackable layer and the one or more other stackable layers can bealigned to facilitate alignment of the channel and the one or more otherchannels. Additionally, sintering associated with the stackable layerand the one or more other stackable layers can be performed in responseto pressure applied to a set of surfaces associated with the stackablelayer and the one or more other stackable layers (e.g., a top surface ofthe cold plate device and a bottom surface of the cold plate device).Additionally or alternatively, welding associated with the stackablelayer and the one or more other stackable layers can be performed inresponse to pressure applied to a set of surfaces associated with thestackable layer and the one or more other stackable layers (e.g., a topsurface of the cold plate device and a bottom surface of the cold platedevice).

For simplicity of explanation, the methodologies are depicted anddescribed as a series of acts. It is to be understood and appreciatedthat the subject innovation is not limited by the acts illustratedand/or by the order of acts, for example acts can occur in variousorders and/or concurrently, and with other acts not presented anddescribed herein. Furthermore, not all illustrated acts can be requiredto implement the methodologies in accordance with the disclosed subjectmatter. In addition, those skilled in the art will understand andappreciate that the methodologies could alternatively be represented asa series of interrelated states via a state diagram or events. Theflowchart and block diagrams in the Figures illustrate the architecture,functionality, and operation of possible implementations of systems,methods, apparatuses and devices according to various embodiments of thepresent invention. In some alternative implementations, the functionsnoted in the blocks can occur out of the order noted in the Figures. Forexample, two blocks shown in succession can, in fact, be executedsubstantially concurrently, or the blocks can sometimes be executed inthe reverse order, depending upon the functionality involved.

In addition, the term “or” is intended to mean an inclusive “or” ratherthan an exclusive “or.” That is, unless specified otherwise, or clearfrom context, “X employs A or B” is intended to mean any of the naturalinclusive permutations. That is, if X employs A; X employs B; or Xemploys both A and B, then “X employs A or B” is satisfied under any ofthe foregoing instances. Moreover, articles “a” and “an” as used in thesubject specification and annexed drawings should generally be construedto mean “one or more” unless specified otherwise or clear from contextto be directed to a singular form. As used herein, the terms “example”and/or “exemplary” are utilized to mean serving as an example, instance,or illustration. For the avoidance of doubt, the subject matterdisclosed herein is not limited by such examples. In addition, anyaspect or design described herein as an “example” and/or “exemplary” isnot necessarily to be construed as preferred or advantageous over otheraspects or designs, nor is it meant to preclude equivalent exemplarystructures and techniques known to those of ordinary skill in the art.

As it is employed in the subject specification, the term “electronicdevice” can refer to substantially any computing processing unit ordevice comprising, but not limited to, single-core processors;single-processors with software multithread execution capability;multi-core processors; multi-core processors with software multithreadexecution capability; multi-core processors with hardware multithreadtechnology; parallel platforms; and parallel platforms with distributedshared memory. Additionally, an electronic device and/or a processor canrefer to an integrated circuit, an application specific integratedcircuit (ASIC), a digital signal processor (DSP), a field programmablegate array (FPGA), a programmable logic controller (PLC), a complexprogrammable logic device (CPLD), a discrete gate or transistor logic,discrete hardware components, or any combination thereof designed toperform the functions described herein. Further, electronic devicesand/or processors can exploit nano-scale architectures such as, but notlimited to, molecular and quantum-dot based transistors, switches andgates, in order to optimize space usage or enhance performance of userequipment. An electronic device and/or a processor can also beimplemented as a combination of computing processing units.

What has been described above include mere examples of systems andmethods. It is, of course, not possible to describe every conceivablecombination of components or methods for purposes of describing thisdisclosure, but one of ordinary skill in the art can recognize that manyfurther combinations and permutations of this disclosure are possible.Furthermore, to the extent that the terms “includes,” “has,”“possesses,” and the like are used in the detailed description, claims,appendices and drawings such terms are intended to be inclusive in amanner similar to the term “comprising” as “comprising” is interpretedwhen employed as a transitional word in a claim.

The descriptions of the various embodiments have been presented forpurposes of illustration, but are not intended to be exhaustive orlimited to the embodiments disclosed. Many modifications and variationswill be apparent to those of ordinary skill in the art without departingfrom the scope and spirit of the described embodiments. The terminologyused herein was chosen to best explain the principles of theembodiments, the practical application or technical improvement overtechnologies found in the marketplace, or to enable others of ordinaryskill in the art to understand the embodiments disclosed herein.

1. An apparatus, comprising: a first stackable layer that comprises afirst channel formed within the first stackable layer, wherein the firstchannel comprises a first channel length, and wherein the first channelreceives a coolant fluid via an inlet channel through the firststackable layer and aligned with an inlet port of the apparatus; and asecond stackable layer having the inlet channel through the secondstackable layer and that comprises a second channel that provides a pathfor the coolant fluid to flow between the first channel and an outletport of the apparatus, wherein the second channel comprises a secondchannel length that is different than the first channel length.
 2. Theapparatus of claim 1, wherein the apparatus further comprises a manifoldlayer 170 that comprises the inlet port and the outlet port, and whereinthe second stackable layer is positioned between the first stackablelayer and the manifold layer.
 3. The apparatus of claim 1, wherein thesecond channel is a patterned through-hole region of the secondstackable layer.
 4. The apparatus of claim 1, wherein the path is afirst path, and wherein the second stackable layer comprises athrough-hole region that provides a second path for the coolant fluid toflow between the inlet port and the first channel.
 5. The apparatus ofclaim 4, wherein the second stackable layer comprises a solid materialregion between the through-hole region and the second channel.
 6. Theapparatus of claim 2, wherein the first channel and the second channelform a set of expanding channels for the apparatus, and wherein a heightof the set of expanding channels increases along a flow direction of thecoolant fluid through the apparatus toward the outlet port.
 7. Theapparatus of claim 1, wherein the first channel is associated with aplurality of wall structures, and wherein a height of the plurality ofwall structures corresponds to a depth of the first channel.
 8. Theapparatus of claim 1, wherein the apparatus comprises a third channeland a solid material region, and wherein the solid material regionseparates the third channel from another channel.
 9. The apparatus ofclaim 8, wherein the third channel comprises a nozzle region thatprovides an opening to the direct the coolant fluid from the thirdchannel.
 10. The apparatus of claim 9, wherein a location of the nozzleregion corresponds to a region of an electronic device that satisfies adefined criterion, and wherein the apparatus is coupleable to theelectronic device and provides two-phase cooling of the electronicdevice.
 11. The apparatus of claim 1, wherein the apparatus furthercomprises a third stackable layer that comprises a third channel thatprovides the path for the coolant fluid to flow between the firstchannel and the outlet port, and wherein the third channel comprise athird channel length that is different than the first channel length andthe second channel length.
 12. A method, comprising: receiving coolantfluid via an inlet port of a cold plate device coupled to an electronicdevice; facilitating flow of the coolant fluid through the cold platedevice based on a stack of channels having different lengths and in thecold plate device, wherein the stack of channels has a height thatincreases from a first channel to a second channel along a flowdirection of the coolant fluid through the cold plate device towards anoutlet port, and wherein the second channel is at a greater height thanthe first channel; and providing an exit for the coolant fluid via theoutlet port of the cold plate device, wherein the outlet port receivesthe coolant fluid from the stack of expanding channels.
 13. The methodof claim 12, wherein the receiving the coolant fluid comprises receivinga liquid coolant via the inlet port of the cold plate device thatincludes the stack of expanding channels.
 14. The method of claim 12,wherein the providing the exit for the coolant fluid comprises providinga path for a liquid-vapor mixture to exit the cold plate device via theoutlet port.
 15. The method of claim 12, wherein the facilitating theflow of the coolant fluid through the cold plate device based on thestack of expanding channels comprises reducing a temperature of theelectronic device coupled to the cold plate device.
 16. The method ofclaim 12, wherein the facilitating the flow of the coolant fluid throughthe cold plate device based on the stack of expanding channels comprisesimproving energy efficiency of a two-phase cooling system that providesthe coolant fluid to the cold plate device.
 17. A cold plate device,comprising: a first stackable layer that comprises a first channelformed within the first stackable layer, wherein the first channelreceives a coolant fluid via an inlet port of the cold plate device; anda second stackable layer that comprises a second channel formed withinthe second stackable layer, wherein the first channel and the secondchannel form a set of channels, and wherein a height of a stack of theset of channels increases linearly from the first channel to the secondchannel along a path for the coolant fluid to flow between the inletport and an outlet port of the cold plate device.
 18. The cold platedevice of claim 17, wherein a greatest level of the height of the stackof the set of channels is proximate to the outlet port of the cold platedevice.
 19. The cold plate device of claim 17, wherein the first channeland the second channel are parallel channels within the cold platedevice.
 20. The cold plate device of claim 17, wherein the secondchannel is a patterned through-hole region of the second stackable layerthat allows the coolant fluid to flow between the first stackable layerand the second stackable layer.